2010年7月15日-17日青岛·第六届机电一体化与嵌入式系统及应用国际学术会议
发布人:dengyp 更新时间:2010/7/12 16:00:26 点击数:1170● 会议名称(中文): 第六届机电一体化与嵌入式系统及应用国际学术会议
● 会议名称(英文): The 6th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA10)
● 所属学科: 动力与电气工程
● 会议类型: 国际会议
● 会议论文集是否检索: 不详
● 开始日期: 2010-7-15
● 结束日期: 2010-7-17
● 所在国家: 中华人民共和国
● 所在城市: 山东省 青岛市
● 主办单位: IEEE Intelligent Transportation Systems Society
● 承办单位: ASME Division of Design Engineering,IEEE Control System Society,Chinese Academy of Sciences,Chinese Association for Automation,Chinese Mechanical Engineering Society,National Natural Science Foundation of China
● 会议主席: Harry H. Cheng
● 重要日期
全文截稿日期: 2010-2-12
论文录用通知日期 2010-4-18
● 会务组联系方式
E-mail: Ieeemesa2010@gmail.com
● 会议网站: http://www.asmemesa.org
● 会议背景介绍:
Mechanical and electrical systems show an increasing integration of mechanics with electronics and information processing. This integration is between the components (hardware) and the information-driven functions (software), resulting in integrated systems called mechatronic systems. The development of mechatronic systems involves finding an optimal balance between the basic mechanical structure, sensor and actuators, automatic digital information processing and control in which embedded
systems play a key role. The field of embedded system and mechatronics is becoming evermore challenging; issues in embedded software lie at the focus of researchers both in industry and academia. The goal of this 6th IEEE/ASME MESA, MESA10, is to bring together experts from the fields of mechatronic and embedded systems, disseminate the recent advances made in the area, discuss future research directions, and exchange application experience. The conference program is organized in a number of symposia.
● 征文范围及要求:
Paper Submission:
Complete manuscripts in PDF format must be electronically submitted to the conference website http://www.asmemesa.org. Submitted manuscripts should be six (6) pages or less in IEEE two-column format, including figures, tables, and references. Please use the LaTeX style file or Microsoft Word template available from the conference website to prepare your manuscript.
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