2008年5月26日-30日北京第九届国际移动数据管理大会
发布人:chenqingqing 更新时间:2007/7/23 15:19:40 点击数:882
所属学科:信息科学与系统科学 电子、通信与自动控制技术 计算机科学技术
会议类型:国际会议
开始日期:2008-5-26至2008-5-30
所在城市:北京市 海淀区
主办单位:Renmin University of China;WAMDM LAB
议题:Topics of interest include、but are not limited to、the following.
会议主席:Dik Lun Lee;Ling Liu;Timos Sellis
组织委员会主席:Jidong Chen
程序委员会主席:Xiaofeng Meng;Hui Lei;Stephane Grumbach
会议网站:http://idke.ruc.edu.cn/mdm2008/
会议背景介绍:Wednesday, 13 December 2008
The significant advances in wireless communications, the ever increasing availability of mobile multi-purpose devices, and the fast growth in sensors and actuators have created a global computing infrastructure that is profoundly changing the way people live and work. People interact with themselves, the physical world, and information services using a wide range of devices connected together via a variety of networks, enabling computing and communication at an unprecedented scale and density.
This new infrastructure presents a number of challenges especially when it comes to data-intensive applications: enormous scale, varying and intermittent connectivity, location dependence and context awareness, limited bandwidth and power capacity, small device size, and multimedia delivery across hybrid networks.
Conventional issues in data management have to be considered and evaluated anew in this rapidly changing environment. Non-traditional issues including mobility, data semantics, context modeling, broadcast and multicast delivery, data availability, trust and privacy must also be addressed effectively.
The latest of a successful series, MDM 2008 provides a high-quality forum for the presentation of research results on data management issues in the evolving world of mobile, wireless, and pervasive computing
征文范围及要求: The conference invites original, unpublished submissions not exceeding 8 pages in the camera-ready IEEE style. Submissions in PDF format must be uploaded to the conference web-based submission system at https://cmt.research.microsoft.com/MDM2008/.
Industrial/experience papers as well as proposals for panels, demos, seminars, and workshops are also sought. Submission instructions will be made available on the conference homepage. Industrial/experience papers are expected to discuss novel aspects of deployed applications or prototypes as well as experiences and standards.





















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